10. |
Takhee Lee, “Molecular Nanoelectronics”, July 20, 2004, Micro Bio Chip Center, Hanyang University (Ansan), Seoul, Korea. [Seminar]
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9. |
Takhee Lee, “Intrinsic Electronic Conduction Mechanisms in Self-Assembled Monolayers”, June 28, 2004, 삼성종합기술원 미래기술연구회 나노 소그룹 Workshop, Seoul, Korea. [Seminar]
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8. |
Wenyong Wang, Takhee Lee, Ilona Kretzschmar, Mark A. Reed “Intrinsic Electronic Tunneling Spectroscopy of Self-Assembled Monolayers”, 2004 EMC Electronic Materials Conference, June 23-25, 2004, Notre Dame, IN, USA.
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7. |
Takhee Lee, “Intrinsic Electronic Conduction Mechanisms in Self-Assembled Monolayers”, June 21, 2004, Korea Research Institute of Chemical Technology, Daejeon, Korea. [Seminar]
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6. |
Takhee Lee, “Intrinsic Electronic Conduction Mechanisms in Self-Assembled Monolayers”, 극미세 과제발표회 초정강연, June 21, 2004, Korea Research Institute of Standards and Technology, Daejeon, Korea. [Seminar]
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5. |
Takhee Lee, Wenyong Wang, Mark A. Reed, “Intrinsic Electronic Conduction Mechanisms in Self-Assembled Monolayers”, ME&D 2004, the 15th Molecular Electronics and Devices Symposium, June 17-18, 2004, BioNanotechnology Center, Pohang University of Science and Technology, Pohang, Korea.
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4. |
Takhee Lee, Wenyong Wang, Mark A. Reed, “Intrinsic Electronic Conduction Mechanisms in Self-Assembled Monolayers”, EM-NANO2004, 2004 International Symposium on Organic and Inorganic Electronic Materials and Related Nanotechnologies, June 7-10, 2004, Toki Messe, Niigata, Japan. [Invited talk]
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3. |
Takhee Lee, “Intrinsic Molecular Electronic Conduction Mechanisms in Self-Assembled Monolayers”, Hongik University, Seoul, Korea, June 5, 2004. [Seminar]
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2. |
Takhee Lee, Wenyong Wang, Mark A. Reed, “Intrinsic Molecular Electronic Conduction Mechanisms in Self-Assembled Monolayers”, CIAR (Canadian Institute of Advanced Research) Nanoelectronics Workshop, Mont-Tremblant, Quebec, Canada, March. 26-28, 2004. [Invited talk]
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1. |
Takhee Lee, “Intrinsic Molecular Electronic Conduction Mechanisms in Self-Assembled Monolayers”, Seminar in School of Electrical and Computer Engineering, Purdue University, USA, Feb. 25, [Seminar]
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